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狮力昂Sliontec UV膜 NO.6360-20

狮力昂Sliontec UV膜 NO.6360-20

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狮力昂Sliontec UV膜 NO.636-020 Dicing tape (for Wafer产品描述

No.6360-20        

T:100um    PO:90um   Adhesive:10um  High adhesion for chip flying

 

NO.636020 Dicing tape (for Wafer)

roduct Introduction

Dicing tapes (for wafer) consist of higher isotropic olefin backing and UV peeling adhesive.

 

Applications and Features

  • For all kinds of wafer dicing
  • Dicing tape(for Wafer)
  • High fixation power
 

Structure

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Thickness (mm):0.100

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General Property

Test Item Unit Value
Adhesion     N/10mm 3.20
Tack Ball No. -
Holding power Creep mm/24h <0.1
Adhesion To UV N/10mm 0.22

*Test Method: In accordance with sliontec method. 
*Holding power: 40°C, 9.8 N

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